Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate
To obtain high-strength joints suitable for three-dimensional (3D) packaging, SiC nanowires (NWs) were doped to the Sn1.0Ag0.5Cu (SAC105) solder, and the conventional Cu substrate was replaced with nanocrystalline (NC) Cu to form Cu/solder/NC Cu solder joints. It was found that the application of Si...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423014229 |