Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate
To obtain high-strength joints suitable for three-dimensional (3D) packaging, SiC nanowires (NWs) were doped to the Sn1.0Ag0.5Cu (SAC105) solder, and the conventional Cu substrate was replaced with nanocrystalline (NC) Cu to form Cu/solder/NC Cu solder joints. It was found that the application of Si...
Main Authors: | Xiao Lu, Liang Zhang, Yong-huan Guo, Li-Yin Gao, Xi Wang, Chen Chen, Zhi-Quan Liu |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2023-07-01
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Series: | Journal of Materials Research and Technology |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423014229 |
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