Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Abstract Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However...

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Bibliographic Details
Main Authors: Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Yiyang Bao, Huanfa Peng, Muhammad Rodlin Billah, Stefan Singer, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Format: Article
Language:English
Published: Nature Portfolio 2021-08-01
Series:Scientific Reports
Online Access:https://doi.org/10.1038/s41598-021-95981-w

Internet

https://doi.org/10.1038/s41598-021-95981-w

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