STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE
The influence of thermal cycle loading on optoelectronic PCB（Printed Circuit Board） reliability was presented.In product conceptual design stage,the three-dimensional finite element model of photoelectric PCB was established.The finite element analysis was carried out under thermal cycle loading whi...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2017-01-01
|
| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2017.04.028 |