Study on the formability of copper foils during multi-step micro deep drawing
In this work, the formability of copper foils was analyzed based on a series of multi-step micro deep drawing (MMDD) tests. The copper foils were annealed at temperatures ranging from 300 to 700 °C for 5 min, followed by tensile tests and electron backscatter diffraction (EBSD) tests for the explora...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423031678 |