Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
The wetting and adhesion properties of undulated a-C:H surfaces were investigated. The nano-undulated a-C:H films were prepared by radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM and AFM analysis showed that the s...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Japanese Society of Tribologists
2008-10-01
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| Series: | Tribology Online |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/trol/3/5/3_5_294/_pdf/-char/en |