Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is in...

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Bibliographic Details
Main Authors: Hsien-Chie Cheng, Ling-Ching Tai, Yan-Cheng Liu
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Materials
Subjects:
flip chip package on package
finite element analysis
viscoelastic behavior
process-induced warpage
trace mapping
effective modeling
Online Access:https://www.mdpi.com/1996-1944/14/17/4816

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https://www.mdpi.com/1996-1944/14/17/4816

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