Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material

Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material

The current study presents the electron beam melting (EBM) efficiency of copper technogenic material with high impurity content (Se, Te, Pb, Bi, Sn, As, Sb, Zn, Ni, Ag, etc.) by means of thermodynamic analysis and experimental tests. On the basis of the calculated values of Gibbs free energy and the...

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Bibliographic Details
Main Authors: Katia Vutova, Vladislava Stefanova, Vania Vassileva, Milen Kadiyski
Format: Article
Language:English
Published: MDPI AG 2022-01-01
Series:Materials
Subjects:
copper technogenic material
electron beam
thermodynamic analysis
removal efficiency
Online Access:https://www.mdpi.com/1996-1944/15/3/936

Internet

https://www.mdpi.com/1996-1944/15/3/936

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