Enhanced ductility of WMoCu alloy through the formation of nanometer-to-micrometer-thick dual-phase transition phase layer
Adding an appropriate interfacial layer is a viable way to decrease the WW contiguity and enhance the interfacial bonding of WCu alloy simultaneously, hence increase the tensile ductility. In this regard, we prepared a new kind of WMoCu alloy with transition phase (TP) existing between W particl...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-02-01
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| Series: | Materials & Design |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127518308797 |