Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach

Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach

The recovery of metals from discarded mobile phones has been of interest due to its environmental and economic benefits. This work presents a simple and effective approach for leaching copper (Cu) from the printed circuit boards of discarded mobile phones by combining ultrasound and ozone approaches...

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Bibliographic Details
Main Authors: Nguyen Thi Hong Hoa, Nguyen To Hoan, Nghia Nguyen Trong, Nguyen Thi Ngoc Linh, Bui Minh Quy, Thi Thu Ha Pham, Van Que Nguyen, Phuoc Nguyen Van, Vinh Dinh Nguyen
Format: Article
Language:English
Published: MDPI AG 2023-06-01
Series:Metals
Subjects:
ultrasound
ozone
copper
printed circuit boards
leaching efficiency
Online Access:https://www.mdpi.com/2075-4701/13/6/1145

Internet

https://www.mdpi.com/2075-4701/13/6/1145

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