Development of Fixture Element for Vacuum Transportation of Silicon Wafer Using Electro-Rheological Gel

Semiconductor process technology increasingly requires high accuracy and efficiency. In the case of processing thin fragile substrate such as silicon wafer, it has to be fixed with low strain. In addition, its fixture device can be used under vacuum condition because some processes are carried out i...

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Bibliographic Details
Main Authors: Masayuki TANAKA, Yasuhiro KAKINUMA, Tojiro AOYAMA, Hidenobu ANZAI, Takafumi KAWAGUCHI
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2008-08-01
Series:Journal of Advanced Mechanical Design, Systems, and Manufacturing
Subjects:
Online Access:https://www.jstage.jst.go.jp/article/jamdsm/2/4/2_4_762/_pdf/-char/en