Packaging and Antenna-Assembled Hybrid Stacked PCB with Novel Vertical Transition for 39 GHz 5G Base Stations
This paper proposes a novel packaging and large-scale antenna-assembled structure for a printed circuit board (PCB) that reinforces productivity, facilitates cost reduction, and maintains reliability. This was achieved by splitting the antenna from the main board and packaging it into a radio-freque...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Korean Institute of Electromagnetic Engineering and Science
2024-01-01
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| Series: | Journal of Electromagnetic Engineering and Science |
| Subjects: | |
| Online Access: | https://www.jees.kr/upload/pdf/jees-2024-1-r-201.pdf |