Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging
Abstract Internal insulation of high‐voltage power modules is facing interesting failure risks, including high temperature overheating, breakdown fault, material cracking etc., so it is imperative to urgently develop new dielectric materials with high thermal conductivity (λ), outstanding electrical...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2024-10-01
|
| Series: | High Voltage |
| Online Access: | https://doi.org/10.1049/hve2.12443 |