Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer. The paper aims at a better understanding of the planarization (polishing) and micromachining. The...

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Bibliographic Details
Main Authors: Filip Ilie, George Ipate
Format: Article
Language:English
Published: MDPI AG 2017-05-01
Series:Lubricants
Subjects:
nanoparticle interaction
material removal rate
etching rate
friction at interface
slurry stability
corrosion products
Online Access:http://www.mdpi.com/2075-4442/5/2/15

Internet

http://www.mdpi.com/2075-4442/5/2/15

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