Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups
In response to the increasing demand for flexible devices, there is increasing effort to manufacture flexible electrodes. However, the difficulty of handling a thin film is an obstacle to the production of flexible electrodes. In this study, a heat-induced peelable pressure-sensitive adhesive (h-PSA...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-05-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/11/5/1250 |