Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package
In this work, a cost-effective organic package substrate embedded coupled magnetic core inductor technology is proposed and demonstrated for power supply in package applications. Based on a novel lithographic via process, it involves a solid copper pillar electroplating step for creating a groove an...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-05-01
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| Series: | Results in Physics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379724003115 |