Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package
In this work, a cost-effective organic package substrate embedded coupled magnetic core inductor technology is proposed and demonstrated for power supply in package applications. Based on a novel lithographic via process, it involves a solid copper pillar electroplating step for creating a groove an...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-05-01
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| Series: | Results in Physics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379724003115 |
| _version_ | 1797220295010942976 |
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| author | Weihao Zhang Guoyun Zhou Yan Hong Xianming Chen Benxia Huang Xiaowei Xu Shuai Ding Zhaojun Zhu Yongmao Huang Wei He |
| author_facet | Weihao Zhang Guoyun Zhou Yan Hong Xianming Chen Benxia Huang Xiaowei Xu Shuai Ding Zhaojun Zhu Yongmao Huang Wei He |
| author_sort | Weihao Zhang |
| collection | DOAJ |
| description | In this work, a cost-effective organic package substrate embedded coupled magnetic core inductor technology is proposed and demonstrated for power supply in package applications. Based on a novel lithographic via process, it involves a solid copper pillar electroplating step for creating a groove and integration of the vertical interconnects of the inductor. The primary and secondary windings of the coupled inductor are interleaved on the rectangular magnetic composite core which is accommodated within the groove. The coupled inductor combines solid vertical interconnecting with low loss magnetic composite core, therefore bringing together tight process tolerances and superior current capability. Experimental results show that the 2.9-mm2 coupled inductor achieves a high inductance to resistance ratio of 0.28 nH/mΩ, and a coupling factor of 0.57. In addition, the proposed inductor achieves an ultra-high saturation current of 16.52 A that is the highest reported value for a high-frequency integrated magnetic core inductor to the best of our knowledge. The performance of the coupled inductor has been calculated for a standard 1.8 to 1 V interleaved converter. Notably, it demonstrated a remarkable efficiency exceeding 95% across a wide range of phase currents between 0.11 and 2.32 A. |
| first_indexed | 2024-04-24T12:47:16Z |
| format | Article |
| id | doaj.art-d4dd60c9f6464c69be98b05966c2c927 |
| institution | Directory Open Access Journal |
| issn | 2211-3797 |
| language | English |
| last_indexed | 2024-04-24T12:47:16Z |
| publishDate | 2024-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Physics |
| spelling | doaj.art-d4dd60c9f6464c69be98b05966c2c9272024-04-07T04:35:35ZengElsevierResults in Physics2211-37972024-05-0160107628Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in packageWeihao Zhang0Guoyun Zhou1Yan Hong2Xianming Chen3Benxia Huang4Xiaowei Xu5Shuai Ding6Zhaojun Zhu7Yongmao Huang8Wei He9University of Electronic Science and Technology of China, School of material and energy, Chengdu, 610054, Sichuan, ChinaUniversity of Electronic Science and Technology of China, School of material and energy, Chengdu, 610054, Sichuan, China; Corresponding author.University of Electronic Science and Technology of China, School of material and energy, Chengdu, 610054, Sichuan, ChinaZhuhai ACCESS Semiconductor Co. Ltd., Zhuhai, 519175, Guangdong, ChinaZhuhai ACCESS Semiconductor Co. Ltd., Zhuhai, 519175, Guangdong, ChinaZhuhai ACCESS Semiconductor Co. Ltd., Zhuhai, 519175, Guangdong, ChinaUniversity of Electronic Science and Technology of China, Institute of applied physics, Chengdu, 610054, Sichuan, ChinaUniversity of Electronic Science and Technology of China, Institute of applied physics, Chengdu, 610054, Sichuan, ChinaXihua University, School of Electrical and Electronic Information, Chengdu, 610039, Sichuan, ChinaUniversity of Electronic Science and Technology of China, School of material and energy, Chengdu, 610054, Sichuan, ChinaIn this work, a cost-effective organic package substrate embedded coupled magnetic core inductor technology is proposed and demonstrated for power supply in package applications. Based on a novel lithographic via process, it involves a solid copper pillar electroplating step for creating a groove and integration of the vertical interconnects of the inductor. The primary and secondary windings of the coupled inductor are interleaved on the rectangular magnetic composite core which is accommodated within the groove. The coupled inductor combines solid vertical interconnecting with low loss magnetic composite core, therefore bringing together tight process tolerances and superior current capability. Experimental results show that the 2.9-mm2 coupled inductor achieves a high inductance to resistance ratio of 0.28 nH/mΩ, and a coupling factor of 0.57. In addition, the proposed inductor achieves an ultra-high saturation current of 16.52 A that is the highest reported value for a high-frequency integrated magnetic core inductor to the best of our knowledge. The performance of the coupled inductor has been calculated for a standard 1.8 to 1 V interleaved converter. Notably, it demonstrated a remarkable efficiency exceeding 95% across a wide range of phase currents between 0.11 and 2.32 A.http://www.sciencedirect.com/science/article/pii/S2211379724003115Coupled magnetic core inductorPackage-embedded integrationInterleaved converterLithographic via technologyPower supply in package |
| spellingShingle | Weihao Zhang Guoyun Zhou Yan Hong Xianming Chen Benxia Huang Xiaowei Xu Shuai Ding Zhaojun Zhu Yongmao Huang Wei He Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package Results in Physics Coupled magnetic core inductor Package-embedded integration Interleaved converter Lithographic via technology Power supply in package |
| title | Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package |
| title_full | Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package |
| title_fullStr | Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package |
| title_full_unstemmed | Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package |
| title_short | Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package |
| title_sort | organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package |
| topic | Coupled magnetic core inductor Package-embedded integration Interleaved converter Lithographic via technology Power supply in package |
| url | http://www.sciencedirect.com/science/article/pii/S2211379724003115 |
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