A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
Integrated circuit (IC) X-ray wire bonding image inspections are crucial for ensuring the quality of packaged products. However, detecting defects in IC chips can be challenging due to the slow defect detection speed and the high energy consumption of the available models. In this paper, we propose...
| Main Authors: | , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-05-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/6/1119 |