Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate
In this work, contact angle, spreading area, and isothermal aging tests were conducted to study the difference between Sn-3Ag-0.5Cu lead-free solder and its composite solder at different multiwalled carbon nanotube reinforcement volume fractions. The material interaction between the solder and the s...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2013-11-01
|
| Series: | Science and Engineering of Composite Materials |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/secm-2012-0152 |