Application of Ni/SiCw Composite Material in MEMS Microspring

Application of Ni/SiCw Composite Material in MEMS Microspring

The microspring is a typical type of device in MEMS devices, with a wide range of application scenarios and demands, among which a popular one is the microelectroformed nickel-based planar microspring prepared by the UV-LIGA technology based on the SU-8 adhesive. It is worth noting that the yield st...

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Bibliographic Details
Main Authors: Liyan Lai, Guanliang Yu, Guilian Wang, Yigui Li, Guifu Ding, Zhuoqing Yang
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Micromachines
Subjects:
MEMS devices
Ni/SiCw
W microspring
mechanical properties
Online Access:https://www.mdpi.com/2072-666X/14/9/1767

Internet

https://www.mdpi.com/2072-666X/14/9/1767

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