Application of Ni/SiCw Composite Material in MEMS Microspring
The microspring is a typical type of device in MEMS devices, with a wide range of application scenarios and demands, among which a popular one is the microelectroformed nickel-based planar microspring prepared by the UV-LIGA technology based on the SU-8 adhesive. It is worth noting that the yield st...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-09-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/9/1767 |
| _version_ | 1797578840311070720 |
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| author | Liyan Lai Guanliang Yu Guilian Wang Yigui Li Guifu Ding Zhuoqing Yang |
| author_facet | Liyan Lai Guanliang Yu Guilian Wang Yigui Li Guifu Ding Zhuoqing Yang |
| author_sort | Liyan Lai |
| collection | DOAJ |
| description | The microspring is a typical type of device in MEMS devices, with a wide range of application scenarios and demands, among which a popular one is the microelectroformed nickel-based planar microspring prepared by the UV-LIGA technology based on the SU-8 adhesive. It is worth noting that the yield strength of the electrodeposited nickel microstructure is low, and the toughness of the structure is not high, which is unbeneficial for the enduring and stable operation of the spring. The paper mainly presents the methods of preparing high-aspect-ratio Ni/SiCw microstructures for MEMS devices based on UV-LIGA technology, developing Ni/SiCw-based microspring samples with a thickness of 300 μm, and applying a DMA tensile tester for mechanical property tests and characterization. In addition, the paper explores the influence of heat treatment at 300 °C and 600 °C on the tensile properties and microstructure of composite coatings. The results show that the W-form microspring prepared from Ni/SiCw composites not only has a wider linear range (about 1.2 times wider) than that of pure nickel material but also has a stronger resistance capacity to plastic deformation, which is competent for MEMS device applications in environments below 300 °C. The research provides a frame of reference and guidance for improving the stable cyclic operating life of such flat springs. |
| first_indexed | 2024-03-10T22:27:28Z |
| format | Article |
| id | doaj.art-d64fd187a42f441ba789b3fe045a42e8 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T22:27:28Z |
| publishDate | 2023-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-d64fd187a42f441ba789b3fe045a42e82023-11-19T12:00:21ZengMDPI AGMicromachines2072-666X2023-09-01149176710.3390/mi14091767Application of Ni/SiCw Composite Material in MEMS MicrospringLiyan Lai0Guanliang Yu1Guilian Wang2Yigui Li3Guifu Ding4Zhuoqing Yang5School of Science, Shanghai Institute of Technology, Shanghai 201418, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai 201418, ChinaSchool of Electronic and Electrical Engineering, Shanghai University of Engineering Science, Shanghai 201620, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai 201418, ChinaNational Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University (SJTU), Shanghai 200240, ChinaNational Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University (SJTU), Shanghai 200240, ChinaThe microspring is a typical type of device in MEMS devices, with a wide range of application scenarios and demands, among which a popular one is the microelectroformed nickel-based planar microspring prepared by the UV-LIGA technology based on the SU-8 adhesive. It is worth noting that the yield strength of the electrodeposited nickel microstructure is low, and the toughness of the structure is not high, which is unbeneficial for the enduring and stable operation of the spring. The paper mainly presents the methods of preparing high-aspect-ratio Ni/SiCw microstructures for MEMS devices based on UV-LIGA technology, developing Ni/SiCw-based microspring samples with a thickness of 300 μm, and applying a DMA tensile tester for mechanical property tests and characterization. In addition, the paper explores the influence of heat treatment at 300 °C and 600 °C on the tensile properties and microstructure of composite coatings. The results show that the W-form microspring prepared from Ni/SiCw composites not only has a wider linear range (about 1.2 times wider) than that of pure nickel material but also has a stronger resistance capacity to plastic deformation, which is competent for MEMS device applications in environments below 300 °C. The research provides a frame of reference and guidance for improving the stable cyclic operating life of such flat springs.https://www.mdpi.com/2072-666X/14/9/1767MEMS devicesNi/SiCwW microspringmechanical properties |
| spellingShingle | Liyan Lai Guanliang Yu Guilian Wang Yigui Li Guifu Ding Zhuoqing Yang Application of Ni/SiCw Composite Material in MEMS Microspring Micromachines MEMS devices Ni/SiCw W microspring mechanical properties |
| title | Application of Ni/SiCw Composite Material in MEMS Microspring |
| title_full | Application of Ni/SiCw Composite Material in MEMS Microspring |
| title_fullStr | Application of Ni/SiCw Composite Material in MEMS Microspring |
| title_full_unstemmed | Application of Ni/SiCw Composite Material in MEMS Microspring |
| title_short | Application of Ni/SiCw Composite Material in MEMS Microspring |
| title_sort | application of ni sicw composite material in mems microspring |
| topic | MEMS devices Ni/SiCw W microspring mechanical properties |
| url | https://www.mdpi.com/2072-666X/14/9/1767 |
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