Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives pre...

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Bibliographic Details
Main Authors: Ângelo D. M. Silva, Mariana M. Silva, Hugo Figueiredo, Isabel Delgado, Paulo E. Lopes, Maria C. Paiva, Loic Hilliou
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Materials
Subjects:
solder paste
electrically conductive adhesives
carbon nanotubes
exfoliated graphite
stencil printing
yield stress
Online Access:https://www.mdpi.com/1996-1944/14/24/7734

Internet

https://www.mdpi.com/1996-1944/14/24/7734

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