Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding

Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding

Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonic...

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Bibliographic Details
Main Authors: Aleksandr Andreevich Vlasov, Topi Uusitalo, Heikki Virtanen, Jukka Viheriala, Mircea Guina
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Photonics Journal
Subjects:
Assembly processes
infrared imaging
infrared microscopy
laser-assisted bonding
photonic integration
silicon devices
Online Access:https://ieeexplore.ieee.org/document/10210034/

Internet

https://ieeexplore.ieee.org/document/10210034/

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