Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding
Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonic...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2023-01-01
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| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10210034/ |
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| author | Aleksandr Andreevich Vlasov Topi Uusitalo Heikki Virtanen Jukka Viheriala Mircea Guina |
| author_facet | Aleksandr Andreevich Vlasov Topi Uusitalo Heikki Virtanen Jukka Viheriala Mircea Guina |
| author_sort | Aleksandr Andreevich Vlasov |
| collection | DOAJ |
| description | Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonics. Modern integration processes impose severe requirements on the design and functionality of research and assembly setups and their parts. In this work we demonstrate a simple, reliable, and cost-effective reconfigurable vacuum sample holder that ensures fast reconfiguration for electronic and photonic integration using laser assisted bonding (LAB) processes. The design is compatible with IR through-silicon microscopy with top and bottom irradiation/illumination architectures, which makes this concept instrumental for a large variety of research, assembly, lithography, and wafer bonding setups. |
| first_indexed | 2024-03-12T13:29:54Z |
| format | Article |
| id | doaj.art-d706ab263b9a4610950dffd7f4e95bc6 |
| institution | Directory Open Access Journal |
| issn | 1943-0655 |
| language | English |
| last_indexed | 2024-03-12T13:29:54Z |
| publishDate | 2023-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Photonics Journal |
| spelling | doaj.art-d706ab263b9a4610950dffd7f4e95bc62023-08-24T23:00:11ZengIEEEIEEE Photonics Journal1943-06552023-01-0115511010.1109/JPHOT.2023.330240410210034Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted BondingAleksandr Andreevich Vlasov0https://orcid.org/0000-0001-8839-6721Topi Uusitalo1https://orcid.org/0000-0002-7953-1036Heikki Virtanen2https://orcid.org/0000-0001-8978-6633Jukka Viheriala3https://orcid.org/0000-0002-1483-5733Mircea Guina4https://orcid.org/0000-0002-9317-8187Optoelectronics Research Centre, Physics Unit, Tampere University, Tampere, FinlandOptoelectronics Research Centre, Physics Unit, Tampere University, Tampere, FinlandOptoelectronics Research Centre, Physics Unit, Tampere University, Tampere, FinlandOptoelectronics Research Centre, Physics Unit, Tampere University, Tampere, FinlandOptoelectronics Research Centre, Physics Unit, Tampere University, Tampere, FinlandCurrent development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonics. Modern integration processes impose severe requirements on the design and functionality of research and assembly setups and their parts. In this work we demonstrate a simple, reliable, and cost-effective reconfigurable vacuum sample holder that ensures fast reconfiguration for electronic and photonic integration using laser assisted bonding (LAB) processes. The design is compatible with IR through-silicon microscopy with top and bottom irradiation/illumination architectures, which makes this concept instrumental for a large variety of research, assembly, lithography, and wafer bonding setups.https://ieeexplore.ieee.org/document/10210034/Assembly processesinfrared imaginginfrared microscopylaser-assisted bondingphotonic integrationsilicon devices |
| spellingShingle | Aleksandr Andreevich Vlasov Topi Uusitalo Heikki Virtanen Jukka Viheriala Mircea Guina Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding IEEE Photonics Journal Assembly processes infrared imaging infrared microscopy laser-assisted bonding photonic integration silicon devices |
| title | Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding |
| title_full | Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding |
| title_fullStr | Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding |
| title_full_unstemmed | Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding |
| title_short | Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding |
| title_sort | reconfigurable vacuum sample holder for through silicon microscopy and laser assisted bonding |
| topic | Assembly processes infrared imaging infrared microscopy laser-assisted bonding photonic integration silicon devices |
| url | https://ieeexplore.ieee.org/document/10210034/ |
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