Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study
The necessities of lead-free solder alloys have been expanded by the advent of eco-friendly technologies of microelectronic packaging industry. Mostly lead-free solder alloys are SAC, which is the alloy of tin, silver and copper metal. Ag3Sn, Cu3Sn and Cu6Sn5 inter-metallic compounds are formed duri...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422011954 |