Microstructure evolution in undercooled Ag-50at. %Cu hypereutectic alloy
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic packaging. The welding performance of Ag–Cu solders is closely associated with their microstructures. However, the microstructure evolution of Ag–Cu alloys during solidification is still poorly understood...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423017751 |