Low temperature Cu–Cu direct bonding in air ambient by ultrafast surface grain growth

Low temperature Cu–Cu direct bonding in air ambient by ultrafast surface grain growth

Fine-grain copper (Cu) films (grain size: 100.36 nm) with a near-atomic-scale surface (0.39 nm) were electroplated. Without advanced post-surface treatment, Cu–Cu direct bonding can be achieved with present-day fine-grain Cu films at 130℃ in air ambient with a minimum pressure of 1 MPa. The instanta...

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Bibliographic Details
Main Authors: Yun-Fong Lee, Yu-Chen Huang, Jui-Sheng Chang, Ting-Yi Cheng, Po-Yu Chen, Wei-Chieh Huang, Mei-Hsin Lo, Kuan-Lin Fu, Tse-Lin Lai, Po-Kai Chang, Zhong-Yen Yu, Cheng-Yi Liu
Format: Article
Language:English
Published: The Royal Society 2024-09-01
Series:Royal Society Open Science
Subjects:
near-atomic-scale surface
Cu–Cu direct bonding
electroplating
self-annealing
ultrafast grain growth
Online Access:https://royalsocietypublishing.org/doi/10.1098/rsos.240459

Internet

https://royalsocietypublishing.org/doi/10.1098/rsos.240459

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