Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor

Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor

Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical process, especially in assembling and interconnecti...

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Bibliographic Details
Main Authors: Dario G. Rosa, Marcio R. Stracke, Victor T. Padilha, Celso Peter, Willyan Hasenkamp Carreira, Carlos Alberto Mendes Moraes
Format: Article
Language:English
Published: Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) 2018-02-01
Series:Materials Research
Subjects:
Ball grid array packaging
intermetallic
shear stress
soldering
Online Access:http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392017000800858&tlng=en

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http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392017000800858&tlng=en

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