Low power and compact architecture of sector transition reduction encoding technique
Today's high-speed technologies are integrating many millions of transistors in a chip by the processes of the Deep-Submicron (DSM) fabrication. The trend leads to an increase in die size and a decrease in the horizontal dimensions of devices and interconnections. Power consumption is the domin...
Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2023-12-01
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Series: | e-Prime: Advances in Electrical Engineering, Electronics and Energy |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2772671123001924 |