Evaluation of thermophysical properties and structure of heat dissipation sheets as thermal interface materials
Thermal interface materials (TIMs) are used in the mounting of semiconductor devices for rapid heat transfer from heat source to heat sink. The advantages of using TIMs include a lower total cost, elimination of liquid cooling, lower system cooling, lower power consumption, longer operating life and...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2022-10-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0119429 |