High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability

High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability

Abstract Thermal pastes, thermally conductive fillers dispersed in liquid matrices, are widely used as thermal interface materials (TIMs). TIMs transfer heat generated from electronics to the surroundings, ensuring optimal operating temperatures. Thus, it is crucial to obtain high thermal conductivi...

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Bibliographic Details
Main Authors: Seong‐Bae Min, Yongsu Jo, Seoung Young Ryu, Joohyung Lee, Cheol‐Woo Ahn, Chae Bin Kim
Format: Article
Language:English
Published: Wiley-VCH 2024-02-01
Series:Advanced Materials Interfaces
Subjects:
form‐factor‐free pastes
Pickering emulsion
recycling
segregated filler structures
thermal pastes
Online Access:https://doi.org/10.1002/admi.202300860

Internet

https://doi.org/10.1002/admi.202300860

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