A monitoring method of semiconductor manufacturing processes using Internet of Things–based big data analysis
This article proposes an intelligent monitoring system for semiconductor manufacturing equipment, which determines spec-in or spec-out for a wafer in process, using Internet of Things–based big data analysis. The proposed system consists of three phases: initialization, learning, and prediction in r...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi - SAGE Publishing
2017-07-01
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| Series: | International Journal of Distributed Sensor Networks |
| Online Access: | https://doi.org/10.1177/1550147717721810 |