A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this soldering material had a shear strength of over 40 MPa at 25 °C. This...
| Main Authors: | , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-01-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/15/3/914 |