An approach for tailoring the interfacial thermal conductance of copper-water nanofluids through ion additions and the underlying mechanism

Smaller Kapitza resistance is known to be the most crucial factor responsible for the larger thermal conductivity of nanofluids. But what the underlying mechanism is remains ambiguous. Non-equilibrium molecular dynamics simulations were performed in the present work to examine the effect of ionic ad...

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Bibliographic Details
Main Authors: Xiao Jin, Chun Shao, Lizhong Huang, Ruijin Wang
Format: Article
Language:English
Published: Elsevier 2024-09-01
Series:Case Studies in Thermal Engineering
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X24009936