Dual heterogeneous Cu–Al2O3/Cu laminated composite with high strength and ductility prepared by accumulative roll bonding
Cu–Al2O3/Cu laminated dual heterogeneous microstructure composites with alternating coarse/fine grain distributions were prepared using a combination of accumulative roll bonding and annealing processes. The average layer thickness of the Al2O3/Cu layers is 2.1 μm and that of the Cu layer is 4.2 μm,...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424003715 |