Dual heterogeneous Cu–Al2O3/Cu laminated composite with high strength and ductility prepared by accumulative roll bonding

Dual heterogeneous Cu–Al2O3/Cu laminated composite with high strength and ductility prepared by accumulative roll bonding

Cu–Al2O3/Cu laminated dual heterogeneous microstructure composites with alternating coarse/fine grain distributions were prepared using a combination of accumulative roll bonding and annealing processes. The average layer thickness of the Al2O3/Cu layers is 2.1 μm and that of the Cu layer is 4.2 μm,...

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Detalles Bibliográficos
Autores principales: Renpeng Chen, Weijie Qian, Haiyan Liu, Weibin Xie, Huiming Chen, Hang Wang, Bin Yang
Formato: Artículo
Lenguaje:English
Publicado: Elsevier 2024-03-01
Colección:Journal of Materials Research and Technology
Materias:
Al2O3/Cu composite
Accumulated roll bonding
Coarse/fine crystalline dual heterogeneous microstructure
Heterogeneous deformation-induced reinforcement
Acceso en línea:http://www.sciencedirect.com/science/article/pii/S2238785424003715

Internet

http://www.sciencedirect.com/science/article/pii/S2238785424003715

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