Thermal Performance and Geometric Optimization of Fractal T-Shaped Highly-Conductive Material for Cooling of a Rectangular Chip
To improve the thermal performance of inserted highly-conductive material (HCM) for the cooling of a chip, the present work numerically investigates the effects of various geometric and structural parameters of a fractal T-shaped branched HCM on the maximum temperature of the chip. These parameters...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Fractal and Fractional |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-3110/6/12/705 |