Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging
In the field of electronics packaging, Pb-bearing solder alloys are mostly used as robust interconnecting materials [...]
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-12-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/11/12/1941 |