Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma

Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma

Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with t...

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Bibliographic Details
Main Authors: Chenggang Jin, Chen Wang, Shitao Song, Yongqi Zhang, Jie Wan, Liang He, Ziping Qiao, Peng E
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Materials
Subjects:
flexible copper-clad laminate
polyimide
no adhesive
helicon wave plasma
roughness
peel strength
Online Access:https://www.mdpi.com/1996-1944/16/18/6214

Internet

https://www.mdpi.com/1996-1944/16/18/6214

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