Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma
Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with t...
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MDPI AG
2023-09-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/16/18/6214 |
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| author | Chenggang Jin Chen Wang Shitao Song Yongqi Zhang Jie Wan Liang He Ziping Qiao Peng E |
| author_facet | Chenggang Jin Chen Wang Shitao Song Yongqi Zhang Jie Wan Liang He Ziping Qiao Peng E |
| author_sort | Chenggang Jin |
| collection | DOAJ |
| description | Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with their use is that the adhesives used in FPCBs cause a high dielectric loss in high-frequency applications. Therefore, it is envisioned that PI films with a low dielectric loss and Cu films can be used to prepare two-layer flexible copper-clad laminates (FCCLs) without any adhesive. However, the preparation of ultra-thin FCCLs with no adhesives is difficult owing to the low peel strength between PI films and Cu films. To address this technical challenge, an FCCL with no adhesive was prepared via high-power helicon wave plasma (HWP) treatment. Field-emission scanning electron microscopy (FE-SEM), X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) were tested. Also, the surface roughness of the PI film and the peel strength between the PI film and Cu film were measured. The experimental results show that the surface roughness of the PI film increased by 40–65% and the PI film demonstrated improved adhesion (the peel strength was >8.0 N/cm) with the Cu film following plasma treatment and Cu plating. |
| first_indexed | 2024-03-10T22:31:31Z |
| format | Article |
| id | doaj.art-dca1d4bfa3204060b49d075d447cbb28 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-10T22:31:31Z |
| publishDate | 2023-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-dca1d4bfa3204060b49d075d447cbb282023-11-19T11:44:27ZengMDPI AGMaterials1996-19442023-09-011618621410.3390/ma16186214Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon PlasmaChenggang Jin0Chen Wang1Shitao Song2Yongqi Zhang3Jie Wan4Liang He5Ziping Qiao6Peng E7Laboratory for Space Environment and Physical Sciences, Harbin Institute of Technology, Harbin 150001, ChinaSchool of Physics, Harbin Institute of Technology, Harbin 150001, ChinaSchool of Electrical Engineering, Liaoning University of Technology, Jinzhou 121001, ChinaSchool of Electrical Engineering and Automation, Harbin Institute of Technology, Harbin 150001, ChinaLaboratory for Space Environment and Physical Sciences, Harbin Institute of Technology, Harbin 150001, ChinaNo. 208 Research Institute of China Ordnance Industries, Beijing 102200, ChinaNo. 208 Research Institute of China Ordnance Industries, Beijing 102200, ChinaLaboratory for Space Environment and Physical Sciences, Harbin Institute of Technology, Harbin 150001, ChinaPolyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with their use is that the adhesives used in FPCBs cause a high dielectric loss in high-frequency applications. Therefore, it is envisioned that PI films with a low dielectric loss and Cu films can be used to prepare two-layer flexible copper-clad laminates (FCCLs) without any adhesive. However, the preparation of ultra-thin FCCLs with no adhesives is difficult owing to the low peel strength between PI films and Cu films. To address this technical challenge, an FCCL with no adhesive was prepared via high-power helicon wave plasma (HWP) treatment. Field-emission scanning electron microscopy (FE-SEM), X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) were tested. Also, the surface roughness of the PI film and the peel strength between the PI film and Cu film were measured. The experimental results show that the surface roughness of the PI film increased by 40–65% and the PI film demonstrated improved adhesion (the peel strength was >8.0 N/cm) with the Cu film following plasma treatment and Cu plating.https://www.mdpi.com/1996-1944/16/18/6214flexible copper-clad laminatepolyimideno adhesivehelicon wave plasmaroughnesspeel strength |
| spellingShingle | Chenggang Jin Chen Wang Shitao Song Yongqi Zhang Jie Wan Liang He Ziping Qiao Peng E Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma Materials flexible copper-clad laminate polyimide no adhesive helicon wave plasma roughness peel strength |
| title | Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma |
| title_full | Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma |
| title_fullStr | Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma |
| title_full_unstemmed | Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma |
| title_short | Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma |
| title_sort | grafting amino groups onto polyimide films in flexible copper clad laminates using helicon plasma |
| topic | flexible copper-clad laminate polyimide no adhesive helicon wave plasma roughness peel strength |
| url | https://www.mdpi.com/1996-1944/16/18/6214 |
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