The Growth of Intermetallic Compounds and Its Effect on Bonding Properties of Cu/Al Clad Plates by CFR
Cu/Al clad plates prepared using a corrugated + flat rolling (CFR) technique were annealed at 300–450 °C for 10–240 min. Furthermore, the interfacial diffusion behavior and the bonding properties of the Cu/Al clad plates were studied in detail. The results demonstrated that, at the initial stage of...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/12/11/1995 |