STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING
The miniature ball grid array（ BGA） solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2016-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.04.014 |