STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING
The miniature ball grid array（ BGA） solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2016-01-01
|
| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.04.014 |
| _version_ | 1797767959558488064 |
|---|---|
| author | LIANG Ying HUANG ChunYue YIN Rui HUANG Wei LI TianMing ZHAO HongWang |
| author_facet | LIANG Ying HUANG ChunYue YIN Rui HUANG Wei LI TianMing ZHAO HongWang |
| author_sort | LIANG Ying |
| collection | DOAJ |
| description | The miniature ball grid array（ BGA） solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three point bending load. The results show that both of the maximum stress and strain of miniature BGA solder joints increase with the increase of the ball diameter,ball height and bending load speed respectively,whereas reduce with the increase of the pad diameter. With 90% confidence,the ball diameter has a certain effect on the maximum bending stress,the ball height and the pad diameter have no significant effect on the maximum stress of miniature BAG solder joint. The ball diameter,pad diameter,ball height affect the maximum stress of miniature BGA solder joints in a descending order. |
| first_indexed | 2024-03-12T20:46:33Z |
| format | Article |
| id | doaj.art-dd9730cec3a343f9911215395f367c19 |
| institution | Directory Open Access Journal |
| issn | 1001-9669 |
| language | zho |
| last_indexed | 2024-03-12T20:46:33Z |
| publishDate | 2016-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj.art-dd9730cec3a343f9911215395f367c192023-08-01T07:42:29ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692016-01-013874474830595479STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDINGLIANG YingHUANG ChunYueYIN RuiHUANG WeiLI TianMingZHAO HongWangThe miniature ball grid array（ BGA） solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three point bending load. The results show that both of the maximum stress and strain of miniature BGA solder joints increase with the increase of the ball diameter,ball height and bending load speed respectively,whereas reduce with the increase of the pad diameter. With 90% confidence,the ball diameter has a certain effect on the maximum bending stress,the ball height and the pad diameter have no significant effect on the maximum stress of miniature BAG solder joint. The ball diameter,pad diameter,ball height affect the maximum stress of miniature BGA solder joints in a descending order.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.04.014Microelectronic package;Ball grid array solder joint;Three point bending load;Finite element analysis;Stress and strain |
| spellingShingle | LIANG Ying HUANG ChunYue YIN Rui HUANG Wei LI TianMing ZHAO HongWang STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING Jixie qiangdu Microelectronic package;Ball grid array solder joint;Three point bending load;Finite element analysis;Stress and strain |
| title | STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING |
| title_full | STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING |
| title_fullStr | STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING |
| title_full_unstemmed | STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING |
| title_short | STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING |
| title_sort | study on electronic package miniature ball grid array solder joints stress and strain under three point bending |
| topic | Microelectronic package;Ball grid array solder joint;Three point bending load;Finite element analysis;Stress and strain |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.04.014 |
| work_keys_str_mv | AT liangying studyonelectronicpackageminiatureballgridarraysolderjointsstressandstrainunderthreepointbending AT huangchunyue studyonelectronicpackageminiatureballgridarraysolderjointsstressandstrainunderthreepointbending AT yinrui studyonelectronicpackageminiatureballgridarraysolderjointsstressandstrainunderthreepointbending AT huangwei studyonelectronicpackageminiatureballgridarraysolderjointsstressandstrainunderthreepointbending AT litianming studyonelectronicpackageminiatureballgridarraysolderjointsstressandstrainunderthreepointbending AT zhaohongwang studyonelectronicpackageminiatureballgridarraysolderjointsstressandstrainunderthreepointbending |