Dual-method molding of 4D shape memory polyimide ink
Thermoset shape memory polyimides (TPIs) are widely used in the fields of high-temperature smart devices. However, the recent molding of polyimides limits most of potentials in the form of two-dimensional film. In this work, we synthesized a novel shape memory polyimide (SMPI) ink that could be used...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-06-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127520301404 |