Modeling and Analysis of Carbon-Nanotube Interconnections for Future Nanotechnology Interconnections between High Speed CMOS Integrated Circuits using FDTD Method
The size reduction of copper interconnects degrades their performances due to increased surface scattering, which significantly reduces the effective electron mean free path. Unlike Cu, CNTs support ballistic electron flow with a lower value of mean free, which highly induces researchers to change c...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2022-01-01
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| Series: | E3S Web of Conferences |
| Online Access: | https://www.e3s-conferences.org/articles/e3sconf/pdf/2022/18/e3sconf_icies2022_01082.pdf |