Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity
The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Sciendo
2021-12-01
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| Series: | Acta Electrotechnica et Informatica |
| Subjects: | |
| Online Access: | https://doi.org/10.2478/aei-2021-0001 |