RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW
Having a unique physical characteristics and stable semiconductor properties,silicon carbide（ Si C） monocrystal wafer has been widely used in integrated circuits,space optics and other fields.In manufacturing process of Si C monocrystal wafer,cutting is primary key process,which the cutting costs ac...
| Príomhchruthaitheoirí: | , , , |
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| Formáid: | Alt |
| Teanga: | zho |
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Editorial Office of Journal of Mechanical Strength
2015-01-01
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| Sraith: | Jixie qiangdu |
| Ábhair: | |
| Rochtain ar líne: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2015.05.004 |