High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits

Abstract Development of manufacture trend for TFTs technologies has focused on improving electrical properties of films with the cost reduction to achieve commercialization. To achieve this goal, high-performance sub-50 nm TFTs-based MOSFETs with ON-current (Ion)/subthreshold swing (S.S.) of 181 µA/...

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Main Authors: Tsung-Ta Wu, Wen-Hsien Huang, Chih-Chao Yang, Hung-Chun Chen, Tung-Ying Hsieh, Wei-Sheng Lin, Ming-Hsuan Kao, Chiu-Hao Chen, Jie-Yi Yao, Yi-Ling Jian, Chiung-Chih Hsu, Kun-Lin Lin, Chang-Hong Shen, Yu-Lun Chueh, Jia-Min Shieh
Format: Article
Language:English
Published: Nature Portfolio 2017-05-01
Series:Scientific Reports
Online Access:https://doi.org/10.1038/s41598-017-01012-y
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author Tsung-Ta Wu
Wen-Hsien Huang
Chih-Chao Yang
Hung-Chun Chen
Tung-Ying Hsieh
Wei-Sheng Lin
Ming-Hsuan Kao
Chiu-Hao Chen
Jie-Yi Yao
Yi-Ling Jian
Chiung-Chih Hsu
Kun-Lin Lin
Chang-Hong Shen
Yu-Lun Chueh
Jia-Min Shieh
author_facet Tsung-Ta Wu
Wen-Hsien Huang
Chih-Chao Yang
Hung-Chun Chen
Tung-Ying Hsieh
Wei-Sheng Lin
Ming-Hsuan Kao
Chiu-Hao Chen
Jie-Yi Yao
Yi-Ling Jian
Chiung-Chih Hsu
Kun-Lin Lin
Chang-Hong Shen
Yu-Lun Chueh
Jia-Min Shieh
author_sort Tsung-Ta Wu
collection DOAJ
description Abstract Development of manufacture trend for TFTs technologies has focused on improving electrical properties of films with the cost reduction to achieve commercialization. To achieve this goal, high-performance sub-50 nm TFTs-based MOSFETs with ON-current (Ion)/subthreshold swing (S.S.) of 181 µA/µm/107 mV/dec and 188 µA/µm/98 mV/dec for NMOSFETs and PMOSFETs in a monolithic 3D circuit were demonstrated by a low power with low thermal budget process. In addition, a stackable static random access memory (SRAM) integrated with TFTs-based MOSFET with static noise margins (SNM) equals to 390 mV at VDD = 1.0 V was demonstrated. Overall processes include a low thermal budget via ultra-flat and ultra-thin poly-Si channels by solid state laser crystallization process, chemical-mechanical polishing (CMP) planarization, plasma-enhanced atomic layer deposition (ALD) gate stacking layers and infrared laser activation with a low thermal budget. Detailed material and electrical properties were investigated. The advanced 3D architecture with closely spaced inter-layer dielectrics (ILD) enables high-performance stackable MOSFETs and SRAM for power-saving IoT/mobile products at a low cost or flexible substrate.
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spelling doaj.art-dfca7c0d50a149839d75f7508a8ac08d2022-12-21T23:38:20ZengNature PortfolioScientific Reports2045-23222017-05-017111110.1038/s41598-017-01012-yHigh Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) CircuitsTsung-Ta Wu0Wen-Hsien Huang1Chih-Chao Yang2Hung-Chun Chen3Tung-Ying Hsieh4Wei-Sheng Lin5Ming-Hsuan Kao6Chiu-Hao Chen7Jie-Yi Yao8Yi-Ling Jian9Chiung-Chih Hsu10Kun-Lin Lin11Chang-Hong Shen12Yu-Lun Chueh13Jia-Min Shieh14National Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesDepartment of Materials Science and Engineering, National Tsing Hua UniversityDepartments of Photonics and Institute of Electro-Optical Engineering, National Chiao-Tung UniversityNational Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesNational Nano Device LaboratoriesDepartment of Materials Science and Engineering, National Tsing Hua UniversityNational Nano Device LaboratoriesAbstract Development of manufacture trend for TFTs technologies has focused on improving electrical properties of films with the cost reduction to achieve commercialization. To achieve this goal, high-performance sub-50 nm TFTs-based MOSFETs with ON-current (Ion)/subthreshold swing (S.S.) of 181 µA/µm/107 mV/dec and 188 µA/µm/98 mV/dec for NMOSFETs and PMOSFETs in a monolithic 3D circuit were demonstrated by a low power with low thermal budget process. In addition, a stackable static random access memory (SRAM) integrated with TFTs-based MOSFET with static noise margins (SNM) equals to 390 mV at VDD = 1.0 V was demonstrated. Overall processes include a low thermal budget via ultra-flat and ultra-thin poly-Si channels by solid state laser crystallization process, chemical-mechanical polishing (CMP) planarization, plasma-enhanced atomic layer deposition (ALD) gate stacking layers and infrared laser activation with a low thermal budget. Detailed material and electrical properties were investigated. The advanced 3D architecture with closely spaced inter-layer dielectrics (ILD) enables high-performance stackable MOSFETs and SRAM for power-saving IoT/mobile products at a low cost or flexible substrate.https://doi.org/10.1038/s41598-017-01012-y
spellingShingle Tsung-Ta Wu
Wen-Hsien Huang
Chih-Chao Yang
Hung-Chun Chen
Tung-Ying Hsieh
Wei-Sheng Lin
Ming-Hsuan Kao
Chiu-Hao Chen
Jie-Yi Yao
Yi-Ling Jian
Chiung-Chih Hsu
Kun-Lin Lin
Chang-Hong Shen
Yu-Lun Chueh
Jia-Min Shieh
High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
Scientific Reports
title High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
title_full High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
title_fullStr High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
title_full_unstemmed High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
title_short High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
title_sort high performance and low power monolithic three dimensional sub 50 nm poly si thin film transistor tfts circuits
url https://doi.org/10.1038/s41598-017-01012-y
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