Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems
In this work, SiN<sub>x</sub>/a-Si/SiN<sub>x</sub> caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and mode...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-04-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/20/7/2133 |