Thermal interface materials: From fundamental research to applications
Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering problem—a heat death problem called in...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2024-12-01
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| Series: | SusMat |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/sus2.239 |