Development of ultrathin thermal ground plane with multiscale micro/nanostructured wicks
In this paper, TGPs with thickness of around 0.53–0.6 mm are developed with copper plate as the casing material, nanostructured copper foam as the wick and electroplated copper pillar as the support of vapor core. The effects of charge amount of water, nanostructured wick, the number of copper foam...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-12-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X20304809 |